00 / Services
Bare board to boxed product, under one roof.
01 / At a glance
49
Years of continuous operation, since 1977
25,000
Square feet of manufacturing floor, Greene NY
3
SMT lines with MIRTEC AOI and paste inspection
100%
Domestic manufacturing, no offshore dependencies
02 / Capabilities
Eight in-house disciplines, one floor, one team.
A.01
Surface Mount Assembly
Three SMT lines running fine-pitch through 0201 passives and BGA. Automated solder-paste inspection and MIRTEC AOI on every run.
SMT × 3 lines
AOI / SPI
IPC Class 2/3
AOI / SPI
IPC Class 2/3
A.02
Through-Hole Assembly
Hand and selective through-hole, mixed-technology builds, and low to mid volume runs for legacy and high-reliability product.
Selective solder
Hand assembly
J-STD-001
Hand assembly
J-STD-001
A.03
Wire Harness and Cable Assembly
Custom cable and harness fabrication to print, including crimp, solder, overmold, and continuity-tested final builds.
Crimp / solder
Continuity test
IPC-WHMA-A-620
Continuity test
IPC-WHMA-A-620
A.04
Complete Box Build with Enclosures
Enclosure integration, mechanical assembly, labeling, and packaging. Finished products ship direct from Greene to end customer.
Mechanical
Labeling / serialization
Drop-ship ready
Labeling / serialization
Drop-ship ready
A.05
Flex Circuit Assembly
Rigid-flex and flex-circuit population using profiled reflow and dedicated tooling for thin substrates.
Rigid-flex
Profiled reflow
IPC Class 3
Profiled reflow
IPC Class 3
A.06
Conformal Coating
Acrylic, urethane, and silicone conformal coatings to IPC-A-610 with selective masking and post-cure inspection.
AR / UR / SR
Selective mask
Cured & inspected
Selective mask
Cured & inspected
A.07
Potting and Encapsulation
Two-part epoxy and urethane potting for harsh-environment, automotive, and outdoor power assemblies.
Epoxy / urethane
Vacuum option
Harsh environment
Vacuum option
Harsh environment
A.08
Custom Test Fixture Engineering
In-house fixture design, build, and functional test programming. Bed-of-nails, ICT, and product-specific functional rigs.
In-house engineering
Bed-of-nails / ICT
Functional test
Bed-of-nails / ICT
Functional test
03 / Process
Six-step turn-key flow, every program.
01
Quote and DFM
Send Gerbers, BOM, assembly drawing, and test requirements. Engineering returns a costed quote and a documented DFM review.
Inputs: Gerber · BOM · CPL · ATP. Output: quote, DFM notes.
02
Kitting and IQC
Bare boards and components are received, counterfeit screened where required, and kitted with full lot-level traceability tied to the job.
Lot capture · MSL handling · Counterfeit avoidance
03
SMT and Inspection
Paste, place, reflow on one of three SMT lines. Automated solder-paste inspection at print, MIRTEC AOI post-reflow, X-ray on call.
SMT × 3 · SPI · MIRTEC AOI · X-ray
04
Through-Hole and Assembly
Selective and hand soldering, mechanical assembly, conformal coating, and potting as the build sheet requires. All to IPC-A-610 Class 2 or 3.
Selective solder · Hand assembly · Coat / pot
05
Functional Test
Custom fixtures engineered in-house run functional, ICT, and burn-in routines. Results captured per serial number for full traceability.
Fixture build · Functional · ICT · Burn-in
06
Box Build and Ship
Enclosure integration, label and serialize, package to spec, and ship from Greene direct to the end customer or distribution center.
Enclosure · Label / serialize · Pack · Ship
04 / Floor walkthrough
Two stations, one floor
Greene, NY · Building 1
Where the work happens.
The two photographs to the right are stations on our floor, not stock images. The same operators have been on these machines for years. Every job that leaves Greene passes through them.
If you want to see the rest, schedule a walk. We host engineering visits.
LocationGreene NY 13778
Floor area25,000 sq ft
SMT lines3
InspectionSPI + MIRTEC AOI
WorkmanshipIPC-A-610 Class 2/3
05 / Quality program
A quality manual you could pull off a shelf.
Q.01
IPC-A-610 Class 2 and Class 3
Workmanship to the published criteria, called out per job. Class 3 available across the SMT and through-hole flow.
Q.02
J-STD-001 soldering
Solder process and operator certification carried by the production floor for both surface mount and through-hole.
Q.03
RoHS production
Full RoHS compliant line with documented process control, segregated parts handling, and lead-free reflow profiles.
Q.04
Toyota Approved Supplier
Audited and approved for the Toyota supply base, with the documentation discipline that approval requires.
Q.05
MIRTEC automated optical inspection
AOI on every SMT run, post-reflow. Defects flagged in line, escapes documented, trends reviewed in the daily quality meeting.
Q.06
Automated solder-paste inspection
SPI at the print stage on every job. Volume, area, and height checks before a single component lands on the board.
Q.07
Daily kaizen reviews
A short, standing morning meeting that walks yesterday's defects, this week's escapes, and the corrective action owner for each.
Q.08
Lot-level traceability
Component lots, operator, machine, and test results recorded against the job. Recall scope can be answered in minutes, not days.
06 / Positioning
What domestic actually changes.
Criterion
Greene, NY
Offshore
Lead time
2 to 4 weeks typical, prototype to production.
8 to 16 weeks plus ocean transit and customs.
Traceability
Lot-level, by serial number, by job.
Often summarized at lot or shipment level.
Communication
Same time zone, direct line to engineering.
Overnight cycle through an account manager.
IP handling
Files stay in the United States, on US-owned systems.
Crosses borders and jurisdictions.
Workmanship
IPC-A-610 Class 2 or 3, J-STD-001, audited.
Variable. Audit access often limited.
Change orders
Days. Engineering responds same shift.
Weeks, plus re-tooling at distance.
07 / Industries served
Six markets, one workmanship standard.
I.01
Robotics
Motion control, drive electronics, and sensor boards for fixed and mobile robotic platforms.
I.02
Commercial aerospace
High-reliability assemblies built to Class 3 workmanship with full lot-level traceability and audited process control.
I.03
Industrial automation
PLC interface boards, I/O modules, and control panel assemblies for plant-floor automation.
I.04
Instrumentation
Precision analog and mixed-signal boards for laboratory, medical-adjacent, and field instrumentation.
I.05
Power electronics
Switching supplies, motor drives, and ruggedized power assemblies with potting and conformal coating in line.
I.06
Automotive
Tier supplier work to the discipline of a Toyota Approved Supplier, including potted and ruggedized assemblies.